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6A2 Back Grinding Wheel High Efficiency Custom Size Sapphire Epitaxial Wafer

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
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    Buy cheap 6A2 Back Grinding Wheel High Efficiency Custom Size Sapphire Epitaxial Wafer from wholesalers
     
    Buy cheap 6A2 Back Grinding Wheel High Efficiency Custom Size Sapphire Epitaxial Wafer from wholesalers
    • Buy cheap 6A2 Back Grinding Wheel High Efficiency Custom Size Sapphire Epitaxial Wafer from wholesalers
    • Buy cheap 6A2 Back Grinding Wheel High Efficiency Custom Size Sapphire Epitaxial Wafer from wholesalers
    • Buy cheap 6A2 Back Grinding Wheel High Efficiency Custom Size Sapphire Epitaxial Wafer from wholesalers
    • Buy cheap 6A2 Back Grinding Wheel High Efficiency Custom Size Sapphire Epitaxial Wafer from wholesalers

    6A2 Back Grinding Wheel High Efficiency Custom Size Sapphire Epitaxial Wafer

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    Brand Name : HT
    Model Number : HT-BGW
    Certification : ISO9001:2015
    Price : Price can be negotiated
    Payment Terms : T/C,T/T
    Supply Ability : 300/pcs per month
    Delivery Time : 2-3weeks
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    6A2 Back Grinding Wheel High Efficiency Custom Size Sapphire Epitaxial Wafer

    6A2 Back Grinding Wheel High Efficiency Custom Size Sapphire Epitaxial Wafer


    Hongtuo, as a major designer, manufacturer and distributor of diamond and CBN grinding wheels, can offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used on different grinding machines made in Europe,America,Japan, and China. They also feature a stable performance and a high cost effectiveness.

    1. Silicon Wafer Back Grinding Wheel

    This abrasive wheel is primarily used for thinning and finishing semiconductor wafers. It comes with a superior grinding performance and a low coast. It can be used on grinding machines manufactured in Japan,Germany and China.

    Grinding Objects: Discrete devices, IC substrate silicon wafers and original silicon wafers

    Work Piece Materials: Monocrystalline silicon and other semiconductor materials

    Processes: Back to front rough and fine grinding

    2. LED Substrate Back Grinding Wheels

    This variety of cup grinding wheel is mainly used in the LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers. It works well with European, American, Japanese and Chinese grinding machines with an excellent performance and cost effectiveness.

    Grinding Objects: Sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers

    Work Piece Materials: Synthetic sapphire, monocrystalline silicon, gallium arsenide and gallium nitride


    Quality 6A2 Back Grinding Wheel High Efficiency Custom Size Sapphire Epitaxial Wafer for sale
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