Electroplated bond HUb blades for silicon wafer,wafer compounds,ceramic

HT series of dicing blades cutting blade is high performance and high quality priduction with new electroforming technology made,can be widely applied in semiconductor wafer,semiconductor resistor,cerami,plastic sealing material.

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Features

1.ultra thin design,can be used to deepen cutting and slotting precessing.

blade thickness range of 0.015mm -0.3mm.

Applications

silicon wafer,wafer compounds,ceramic ,sealed plastic materials,

Related Technical Parameters

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Zhengzhou Hongtuo Superabrasive Tools Co.,Ltd was founded in 1997.It is a high-tech company engaged in R&D,production,sale and service of superabrasive tools.The company has 350 employees,over 300 sets of manufacturing and testing equipments.With 2 advanced metal bonded honing stones and vitrified bonded diamond&CBN grinding wheels production lines,which can produce750 000 pieces honing stones and 4 000 pieces grinding wheels annually.The company has been granted the ISO9001:2000 certificate in 2000.In the same year,it has been obtained the certificate of “high-new technology company”and “high-new technology products”granted by Science&Technology Division of Henan province.

Our products are widely used in the such industries as:automobile parts,motor parts,refrigeration compressor,aviation,hydraulics,sewing-machine parts and bearings.In respect of product quality,development and production capacity,the company is a leading manufacturer in the industry.it can meet all kinds of requirement.At present,a great parts of our proucts are sold to countries and regions as Europe,Japan,Taiwan and South-East Asian countries.

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