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Electroformed Dicing Wafer Saw Blade HT-WSB Lithium Tantalite High Performance

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
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    Buy cheap Electroformed Dicing Wafer Saw Blade HT-WSB Lithium Tantalite High Performance from wholesalers
     
    Buy cheap Electroformed Dicing Wafer Saw Blade HT-WSB Lithium Tantalite High Performance from wholesalers
    • Buy cheap Electroformed Dicing Wafer Saw Blade HT-WSB Lithium Tantalite High Performance from wholesalers
    • Buy cheap Electroformed Dicing Wafer Saw Blade HT-WSB Lithium Tantalite High Performance from wholesalers
    • Buy cheap Electroformed Dicing Wafer Saw Blade HT-WSB Lithium Tantalite High Performance from wholesalers
    • Buy cheap Electroformed Dicing Wafer Saw Blade HT-WSB Lithium Tantalite High Performance from wholesalers

    Electroformed Dicing Wafer Saw Blade HT-WSB Lithium Tantalite High Performance

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    Brand Name : HT
    Model Number : HT-WSB
    Certification : ISO9001:2015&ISO16949
    Price : Price can be negotiated
    Payment Terms : T/C,T/T
    Supply Ability : 500/pcs per month
    Delivery Time : 2-3weeks
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    Electroformed Dicing Wafer Saw Blade HT-WSB Lithium Tantalite High Performance

    Saw blade with diamond plated


    If you’re searching for the right dicing blades, we recommend our HT-RE electroformed bond blades. They are a high performance and high quality wafer saw manufactured using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these super abrasive dicing blades and machining tools, please browse the other pages.

    Features:

    1. The ultra-thin design allows the circular blade to be used for deep cutting and slotting.

    2. The blade thickness ranges from 0.015mm to 0.3mm.

    3. Thanks to a combination of multiple specifications of diamond particles and various bonds, these electroformed dicing blades can be used for cutting and slotting compound semiconductors, silicon wafers and ceramic wafers.

    Applicable Materials:

    Silicon wafer, compound wafer with gallium arsenide, gallium phosphide, ceramics, lithium niobate, lithium tantalite and more.

    Specifications:


    **NOTE: The contents in the above picture provide relevant specifications for the electroformed bond blades. During the purchasing, please tell us all related factors so we can communicate and find the right product for you.

    Technical Parameters of Electroformed Bond Blades

    O.DThicknessI.D
    SizeToleranceSizeStandard toleranceHigh precision toleranceSizeTolerance
    50~ 100+0.020.1~≤ 0.15±0.00525.4
    30
    31.75
    40
    60
    80
    88.9
    +0.02~ 0
    0.15~≤ 0.25±0.005±0.003
    >0.25±0.01±0.005

    Quality Electroformed Dicing Wafer Saw Blade HT-WSB Lithium Tantalite High Performance for sale
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